Solderable intergrated circuit lead frames plated with tin and p

Details Solderable intergrated circuit lead frames plated with tin and p Solderable intergrated circuit lead frames plated with tin and p

1996-06-27

1997-06-03

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257736, 257750, 257751, 257762, 257766, 257768, H01L 23495, H01L 2348, H01L 2352

Patent

active

056357559

ABSTRACT:
A solderable lead frame is disclosed which includes a copper base lead frame containing a one layer or plated tin or tin alloy and another layer of plated palladium. The tin plating covers only external portions of the leads, whereas the palladium covers the external regions including the tin plating, and extends into internal portions of the lead frame. A diffusion barrier, of cobalt or nickel, is provided on the base lead frame beneath the tin plating.

REFERENCES:
patent: 4404079 (1983-09-01), Jahani
patent: 4404080 (1983-09-01), Jahani
patent: 4405432 (1983-09-01), Kosowsky
patent: 4486511 (1984-12-01), Chen et al.
patent: 4628165 (1986-12-01), Nobel et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 4954870 (1990-09-01), Takemura et al.
patent: 5360991 (1994-11-01), Abys et al.
patent: 5436082 (1995-07-01), Mathew

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