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Semiconductor package with stacked dice for a buck converter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor package with warpage resistant substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Semiconductor package without substrate and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Semiconductor package, method for manufacturing the same and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package-on-package system including integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Semiconductor packages for high I/O semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Semiconductor packages having split die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Semiconductor packages with centrally located electrode pads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor packaging structure with the bar on chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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Semiconductor packaging technique yielding increased inner lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor packaging technique yielding increased inner lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor packaging techniques for use with non-ceramic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Semiconductor power device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Semiconductor power device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor power module with flexible circuit leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Semiconductor power package module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Semiconductor sealing mold

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Semiconductor substrate and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
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Semiconductor unit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Semiconductor utilizing grooves in lead and tab portions of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
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