Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1996-09-26
1998-04-28
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257678, 257690, 257695, 257730, H01L 2302
Patent
active
057448582
ABSTRACT:
A greater lead count for a given die area can be achieved with "certain non-square" geometries formed by the inner ends of conductive lines. These include various triangular configurations, as well as "greatly elongated" rectangular, parallelogram and trapezoidal configurations. The conductive lines may be leads of a lead frame, leads on a tape-based package, or traces on ceramic or PCB-substrate packages. The package body may be formed to have a shape similar to that of the die receiving area, and may also be provided with external pins, ball bumps or leads. A number of these "certain non-square" packages may be assembled in an electronic system on a mother board. Unpackaged "certain non-square" dies may be connected to the ends of traces on a substrate, and encapsulated to form a multi-chip module.
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patent: 5293072 (1994-03-01), Tsuji et al.
William C. Ward, Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ns 1 Mbit DRAM Chip by Area Wire Bond Techniques, IEEE, 1988, pp. 552-557.
Brown Peter Toby
LSI Logic Corporation
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