Semiconductor packaging structure with the bar on chip

Details Semiconductor packaging structure with the bar on chip Semiconductor packaging structure with the bar on chip

1998-08-11

1999-12-07

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257671, 361813, H01L 23495, H05K 502

Patent

active

059988576

ABSTRACT:
Disclosed is a semiconductor package where at least one tie bar is arranged on the leadframe such that the die to be packaged is attached to the tie bar by binding tape. The problem of gap or delamination will not occur due to the disuse of silver epoxy and die paddle. The processing time can be reduced and the applicability to die is enhanced.

REFERENCES:
patent: 4289922 (1981-09-01), Devlin
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5521428 (1996-05-01), Hollingsworth et al.
patent: 5610437 (1997-03-01), Frechette
patent: 5723899 (1998-03-01), Shin

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