Semiconductor power module with flexible circuit leadframe

Details Semiconductor power module with flexible circuit leadframe Semiconductor power module with flexible circuit leadframe

2011-06-14

2011-06-14

Gurley, Lynne A. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S719000, C257S712000, C257SE23051

Reexamination Certificate

active

07960817

ABSTRACT:
A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.

REFERENCES:
patent: 4313262 (1982-02-01), Barnes et al.
patent: 5856913 (1999-01-01), Heilbronner
patent: 6731002 (2004-05-01), Choi
patent: 2005/0047186 (2005-03-01), Gerbsch et al.
patent: 0372228 (1990-06-01), None
European Search Report dated May 5, 2009.

Affiliated with

Also associated with

Rating

Semiconductor power module with flexible circuit leadframe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor power module with flexible circuit leadframe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor power module with flexible circuit leadframe will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2668227