Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2007-07-16
2010-11-16
Pham, Thanh V (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S717000, C257S718000, C257S706000, C257S796000, C257S625000, C257S696000, C257SE23102, C257SE23103, C257SE23051, C438S122000, C438S123000, C438S124000
Reexamination Certificate
active
07834433
ABSTRACT:
In one embodiment the present invention includes a semiconductor power device. The semiconductor power device includes a single gauge lead frame, a semiconductor die, and a heat sink. The semiconductor die is attached to a first level of the lead frame. The heat sink is attached to a second level of the lead frame. A molding compound encapsulates the semiconductor die and a portion of the lead frame, such that a portion of the heat sink is outside of the molding compound. The resulting device may be efficiently manufactured as compared to dual gauge lead frame devices or devices where the semiconductor die is not attached to the lead frame.
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Xiaochun Tan
Yunfang Li
Fountainhead Law Group PC
Ligai Maria
Pham Thanh V
Shanghai Kaihong Technology Co., Ltd.
Walsh Chad R.
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