Semiconductor packaging techniques for use with non-ceramic...

Details Semiconductor packaging techniques for use with non-ceramic... Semiconductor packaging techniques for use with non-ceramic...

2006-07-11

2006-07-11

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S712000, C257SE23031, C257SE23051, C257SE23052

Reexamination Certificate

active

07075174

ABSTRACT:
A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer between the die and the carrier. The method further includes attaching the thermal carrier having the IC die attached thereto to an upper surface of the base of the IC package. In this manner, one or more IC dies may be attached to a standard plastic IC package without a significant impact on thermal transfer in the device and at a significant cost savings compared to ceramic IC packages.

REFERENCES:
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 6271581 (2001-08-01), Huang et al.
patent: 6511866 (2003-01-01), Bregante et al.
patent: 6867492 (2005-03-01), Auburger et al.

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