Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2002-10-04
2004-08-10
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S678000, C257S704000, C257S780000, C257S781000, C257S784000
Reexamination Certificate
active
06774465
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor module, and more particularly, to a semiconductor power package module in which a power circuit and a control circuit are assembled in a package.
2. Description of the Related Art
Advancement in the power electronics industry, e.g., inverters and servo drivers, triggers a need for a light and compact power system that is manufactured at a low cost and operates more efficiently. To realize such a power system, various power semiconductor chips are integrated into one package, i.e., a power semiconductor module, and a large number of power devices and control integrated circuits (IC), which control the integrated power semiconductor chips, are integrated into one power semiconductor module that is capable of controlling and protecting power devices. The power semiconductor module is called an ‘intelligent semiconductor power module’.
FIG. 1
is a cross-sectional view of an example 10 of conventional semiconductor power modules. In
FIG. 1
, reference numerals
11
,
13
,
15
,
17
and
19
denote a case, control circuit terminal, a main circuit terminal, a main circuit part and a control circuit part, respectively.
As shown in
FIG. 1
, in the semiconductor power module
10
, all components are attached to an insulating metal substrate
16
and they are connected to one another via a bonding wire
18
. The size of the semiconductor power module
10
is determined by the size of the insulating metal substrate
16
to which all the components are attached. Thus, the more the components attached to the insulating metal substrate
16
are, the bigger the semiconductor power module
10
is, thereby increasing the volume of materials therefor such as the insulating metal substrate
16
and a molding material, and manufacturing costs.
FIG. 2
is a cross sectional view of another example 20 of a conventional semiconductor power module. Here, reference numerals ‘
21
’ and ‘
29
’ denote a terminal and a case, respectively.
Referring to
FIG. 2
, a main circuit part
25
having a power semiconductor device, and a control circuit part
23
having a control circuit device are formed on different substrates that are separated each other in the perpendicular direction. In detail, the main circuit part
25
is attached to a lower substrate, and the control circuit part
23
is attached to an upper substrate. The main circuit part
25
and the control circuit part
23
are connected to each other via connection metal
27
. The portions where the connection metals
27
are in contact with the main circuit part
25
and the control circuit part
23
, are soldered by solder deposits
22
.
In this conventional power semiconductor device, since the main circuit part
25
and the control circuit part
23
are placed on different upper and lower substrates, the connection metals
27
, and the solder deposits
22
are additionally required for connecting the main circuit part
25
and the control circuit part
27
. Therefore, the conventional power semiconductor device is not easy to manufacture, and further, manufacturing costs are increased.
SUMMARY OF THE INVENTION
To solve the above problems, it is desirable to provide a semiconductor power module, which can be made smaller, and which does not require additional connections for connecting a power circuit and a control circuit part.
One embodiment of the invention is directed to a semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising: a case; a terminal inserted into the case, the terminal including a portion protruding upward to the outside of the case, and a portion exposed in the case; a first substrate to which the power circuit chip is attached, the first substrate attached to the case forming the bottom of the package; a second substrate to which the control circuit chip is attached, the second substrate spaced from the first substrate at a predetermined interval in the perpendicular direction in the case; and a cover for covering the top of the case, and forming the top of the package.
Preferably, the case is made of a plastic material.
Preferably, the terminal is made of a copper material that is electroplated with nickel.
Preferably, the first substrate and the power circuit chip, and the first substrate and the control circuit chip are electrically connected to each other via wires, respectively. Preferably, the wires, which connect the first substrate and the power circuit chip each other, are aluminum wires, and the wires, which connect the second substrate and the control circuit chip each other, are gold wires or aluminum wires.
Preferably, the first substrate and the power circuit chip are electrically connected to the exposed portions of the terminal via wires, respectively. At this time, preferably, the wires, which electrically connect the first substrate, and the power circuit chip to the exposed portions of the terminal, are aluminum wires.
Preferably, the first substrate and the power circuit chip are electrically connected to the exposed portions of the terminal via wires, respectively.
Preferably, the second substrate and the exposed portions of the terminal are electrically connected to each other via wires. Also, preferably, the wires, which connect the second substrate to the exposed portions of the terminal, are aluminum wires.
Preferably, the first substrate is a stacked structure in which a copper layer, a ceramic layer and a copper layer are sequentially deposited.
Preferably, the second substrate is a print circuit board.
Preferably, the semiconductor power module further includes a silicon gel (e.g., a silicone gel) for filling the inside of the package.
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Chung Dae-woong
Jeon O-seob
Kim Ji-hwan
Lee Keun hyuk
Clark Jasmine
Fairchild Korea Semiconductor Ltd.
Townsend and Townsend / and Crew LLP
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