LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

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Semiconductor package including flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package including flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package including isolated ring structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package including organo-metallic coating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package including ring structure connected to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package insulation film and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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Semiconductor package leadframe assembly and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Reexamination Certificate

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Semiconductor package produced by solder plating without...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package structure and method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Semiconductor package structure having multiple heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Semiconductor package structure having universal lead frame...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package substrate and ball grid array (BGA) semico

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Patent

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Semiconductor package system with substrate having different...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package system with substrate having different...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package using an aluminum nitride substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Patent

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Semiconductor package with a stacked chip on a leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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Semiconductor package with an embedded printed circuit board...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Semiconductor package with chamfered corners and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Semiconductor package with chip supporting member

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Semiconductor package with circuit side polymer layer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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