Semiconductor package including organo-metallic coating...

Details Semiconductor package including organo-metallic coating... Semiconductor package including organo-metallic coating...

2006-05-23

2006-05-23

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S667000

Reexamination Certificate

active

07049683

ABSTRACT:
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.

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