Semiconductor package insulation film and manufacturing...

Details Semiconductor package insulation film and manufacturing... Semiconductor package insulation film and manufacturing...

2005-05-17

2005-05-17

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S666000

Reexamination Certificate

active

06894374

ABSTRACT:
An insulation film for providing an insulation substrate carrying a semiconductor chip of a semiconductor package. Insulation film10is provided with rows of opposing sprocket holes12formed on either edge of the above mentioned insulation film, and through holes14are disposed two-dimensionally between the rows of sprocket holes12. Pitch p between through holes14is determined by the relationship mp=nL (i.e., n and m are integers, and n<m), wherein pitch of the sprocket holes is taken to be L. Through holes14are selectively utilized during formation of the desired circuit pattern upon insulation film10according to size of the manufactured semiconductor package.

REFERENCES:
patent: 5317188 (1994-05-01), Kondou
patent: 6144102 (2000-11-01), Amagai
patent: 6200824 (2001-03-01), Hashimoto
patent: 6235555 (2001-05-01), Cho
patent: 6309915 (2001-10-01), Distefano
patent: 6506980 (2003-01-01), Hashimoto

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