Semiconductor package structure and method of manufacture

Details Semiconductor package structure and method of manufacture Semiconductor package structure and method of manufacture

2006-04-14

2008-07-22

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S678000

Reexamination Certificate

active

07402895

ABSTRACT:
In one embodiment, a semiconductor package includes a conductive slug and columnar leads in spaced relationship thereto. The columnar leads are coupled to an electronic device attached to the slug, and are exposed at least on one side of the package opposite the die attach slug. The die attach slug is further exposed to provide a package configured in a slug up orientation.

REFERENCES:
patent: 6605866 (2003-08-01), Crowley et al.
patent: 2004/0000702 (2004-01-01), Knapp et al.

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