Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1996-11-18
1998-03-17
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
257687, 257738, 257790, 257795, 257730, 257693, 257678, H01L 2328, H01L 2352
Patent
active
057290504
ABSTRACT:
A semiconductor package substrate and a ball grid array (BGA) semiconductor package using the same include a cavity formed in the substrate, anti-cracking bumpers on the inner substrate surface adjacent to the cavity and a plurality of holes and recesses in the substrate, whereby delamination and cracking which may occur during the credibility checkup can be prevented, thereby improving the package reliability.
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LG Semicon Co. Ltd.
Thomas Tom
Williams Alexander Oscar
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