Semiconductor package system with substrate having different...

Details Semiconductor package system with substrate having different... Semiconductor package system with substrate having different...

2006-03-09

2009-10-06

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S674000, C257SE23031, C257SE23032, C257SE23037

Reexamination Certificate

active

07598599

ABSTRACT:
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

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