Search
Selected: I

Integrated circuit package system with lead structures...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package system with leadframe array

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package system with multiple die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package system with net spacer

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package system with under paddle leadfingers

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package that includes a thermally...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with bonding planes on a ceramic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with device and wire coat assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with electrically isolated leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with ESD protection

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with improved connections

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with improved heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with laminated power cell having...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with lead fingers extending into...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with leadframe enhancement and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with low inductance ground path...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package with overlapped die on a common lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit package-on-package stacking system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit packages with interconnects on top and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Integrated circuit packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.