Integrated circuit package system with net spacer

Details Integrated circuit package system with net spacer Integrated circuit package system with net spacer

2006-04-01

2010-11-09

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE25013, C257S686000, C257S777000, C438S108000

Reexamination Certificate

active

07829986

ABSTRACT:
A method for manufacturing an integrated circuit package system is provided including: forming a strip level net spacer including support bars, tie bars and paddles; configuring the support bars, the tie bars and the paddles to form four or more open regions around each of the paddles; and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices formed above first semiconductor devices and directly attached to the paddles.

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