Integrated circuit package with electrically isolated leads

Details Integrated circuit package with electrically isolated leads Integrated circuit package with electrically isolated leads

2006-04-12

2009-10-27

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S672000, C257S676000

Reexamination Certificate

active

07608914

ABSTRACT:
In one embodiment, an integrated circuit package includes a lead frame with a die paddle and several leads. Portions of the lead frame not having an external electrical connection may be thinned such that they may be encapsulated by an electrically insulating packaging material on the back of the lead frame. Portions of the lead frame having external electrical connections may have a thickness such that they are exposed through the packaging material. The lead frame may be covered by an electrically insulating cover to protect components on the lead frame from erroneous electrical contact or electrostatic discharge (ESD) damage.

REFERENCES:
patent: 6762485 (2004-07-01), Jiang et al.
patent: 2008/0036034 (2008-02-01), Juskey et al.
Lead Frames or Leadframes, webpage [online] [retrieved on Jan. 5, 2006][4 sheets], retrieved from the internet: http://www.semiconfareast.com/leadframes.htm.
Patent Office of the Peoples Republic of China - First Office Action of China Application No. 200580022458.6 dated Feb. 15, 2008; 9 pages.

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