Integrated circuit package with overlapped die on a common lead

Details Integrated circuit package with overlapped die on a common lead Integrated circuit package with overlapped die on a common lead

1996-02-15

1996-12-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257792, 257729, 257686, 257703, 257700, 257666, 257699, H01L 2350, H01L 2310, H01L 2710, H01L 2328

Patent

active

055856683

ABSTRACT:
This invention is for an integrated circuit package which includes two integrated circuit die connected to a common substantially planar lead frame, wherein bond pads on each die face the common lead frame.

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"3D Interconnection For Ultra-Dense Multichip Modules", Abstract, Christian VAL, IEEE, pp. 540-547 no date.

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