Integrated circuit package-on-package stacking system

Details Integrated circuit package-on-package stacking system Integrated circuit package-on-package stacking system

2011-01-11

2011-01-11

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S670000, C257S685000, C257S777000, C257SE25013, C257SE25023, C257SE23031, C257SE23048

Reexamination Certificate

active

07868434

ABSTRACT:
An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.

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