Integrated circuit package system with under paddle leadfingers

Details Integrated circuit package system with under paddle leadfingers Integrated circuit package system with under paddle leadfingers

2011-08-02

2011-08-02

Gurley, Lynne A (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S666000, C257S672000, C257S676000, C257S734000, C257S784000, C257S787000, C257SE23066, C257SE23052, C438S111000, C438S112000, C438S122000, C438S123000, C438S127000, C174S050550, C174S521000, C174S528000, C174S532000, C174S537000, C361S813000, C216S014000

Reexamination Certificate

active

07989931

ABSTRACT:
An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.

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patent: 5335474 (1993-12-01), None

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