Integrated circuit package with ESD protection

Details Integrated circuit package with ESD protection Integrated circuit package with ESD protection

2007-10-23

2007-10-23

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S666000, C438S123000

Reexamination Certificate

active

11062527

ABSTRACT:
A semiconductor chip is attached to bifurcated finger members of a lead frame. A pocket is formed between the semiconductor chip and the lead frame. An opening is formed between the bifurcated fingers for injecting into the pocket a voltage variable material to provide electrostatic discharge protection to circuits connected to the lead frame.

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