Integrated circuit package with laminated power cell having...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S019000, C438S111000, C438S123000

Reexamination Certificate

active

10685825

ABSTRACT:
An electrode that includes an electrically conductive, substantially planar body having a first thickness and a junction area, wherein the junction area is configured to receive a solid state power cell having a second thickness. The electrode also includes an arcuate terminal electrically coupled to the body and configured to position a wire bond terminus at a perpendicular distance from the body, the distance being not substantially less than the sum of the first and second thicknesses.

REFERENCES:
patent: 4024420 (1977-05-01), Anthony et al.
patent: 4042861 (1977-08-01), Yasuda et al.
patent: 4585718 (1986-04-01), Uedaira et al.
patent: 4759771 (1988-07-01), Morra
patent: 4971868 (1990-11-01), Tucholski et al.
patent: 5008776 (1991-04-01), Queyssac
patent: 5089877 (1992-02-01), Queyssac et al.
patent: 5124782 (1992-06-01), Hundt et al.
patent: 5153710 (1992-10-01), McCain
patent: 5196374 (1993-03-01), Hundt et al.
patent: 5294829 (1994-03-01), Hundt
patent: 5323150 (1994-06-01), Tuttle
patent: 5326652 (1994-07-01), Lake
patent: 5338625 (1994-08-01), Bates et al.
patent: 5403782 (1995-04-01), Dixon et al.
patent: 5448110 (1995-09-01), Tuttle et al.
patent: 5451715 (1995-09-01), Hundt et al.
patent: 5475259 (1995-12-01), Kasai et al.
patent: 5497140 (1996-03-01), Tuttle
patent: 5498903 (1996-03-01), Dixon et al.
patent: 5572226 (1996-11-01), Tuttle
patent: RE35765 (1998-04-01), Tuttle
patent: 5776278 (1998-07-01), Tuttle et al.
patent: 5779839 (1998-07-01), Tuttle et al.
patent: 5787174 (1998-07-01), Tuttle
patent: 5864182 (1999-01-01), Matsuzaki
patent: 5900671 (1999-05-01), Takahashi et al.
patent: 6013949 (2000-01-01), Tuttle
patent: 6045652 (2000-04-01), Tuttle et al.
patent: 6160307 (2000-12-01), Kweon
patent: 6218049 (2001-04-01), Bates et al.
patent: 6266647 (2001-07-01), Fernandez
patent: 6278056 (2001-08-01), Sugihara et al.
patent: 6325294 (2001-12-01), Tuttle et al.
patent: 6329705 (2001-12-01), Ahmad
patent: 6346343 (2002-02-01), Notten et al.
patent: 6465129 (2002-10-01), Xu et al.
patent: 6731512 (2004-05-01), Nebrigic et al.
patent: 2003/0201520 (2003-10-01), Knapp et al.
patent: 2005/0026037 (2005-02-01), Riley et al.
patent: 0348018 (1989-12-01), None
patent: 0526063 (1993-02-01), None
patent: 360007760 (1985-01-01), None
patent: 404317364 (1992-11-01), None
patent: 6-85162 (1994-03-01), None
patent: 2001039252 (2001-05-01), None
patent: 200197300 (2001-12-01), None
patent: 2002103823 (2002-06-01), None
patent: 2002080291 (2002-10-01), None
patent: 2003103074 (2003-06-01), None
patent: 2003105255 (2003-06-01), None
patent: 2003085751 (2003-10-01), None
patent: 2003107458 (2003-12-01), None
patent: 2003107475 (2003-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit package with laminated power cell having... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package with laminated power cell having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package with laminated power cell having... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3851259

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.