Integrated circuit package system with leadframe array

Details Integrated circuit package system with leadframe array Integrated circuit package system with leadframe array

2011-03-29

2011-03-29

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257SE23031

Reexamination Certificate

active

07915716

ABSTRACT:
An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.

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