Integrated circuit package system with multiple die

Details Integrated circuit package system with multiple die Integrated circuit package system with multiple die

2007-09-28

2011-11-29

Nguyen, Thinh T (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S685000, C257SE23031, C257SE21505, C438S123000, C438S107000, C438S109000

Reexamination Certificate

active

08067825

ABSTRACT:
An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.

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