Integrated circuit package with device and wire coat assembly

Details Integrated circuit package with device and wire coat assembly Integrated circuit package with device and wire coat assembly

1991-12-20

1993-04-27

Thompson, Gregory D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

174 522, 361388, 361421, 361386, 257688, 437220, H05K 720

Patent

active

052067947

ABSTRACT:
A molded, plastic integrated circuit package is formed wherein a silicone compound is first applied over the exposed surface of the integrated circuit, its bonding wires, and portions of the lead frame including those portions where the bonding wires are attached. Following application of the silicone compound and before molding in plastic, the silicone compound is cured to set and harden the material. With the bonding wires and bonding points thus encapsulated by the silicone compound, the bonding wires are protected from lateral bending forces caused by viscous forces during the process of forming the molded plastic package, and from longitudinal expansion and contraction forces during thermal temperature cycling of the package.

REFERENCES:
patent: 3706840 (1972-12-01), Moyle et al.
patent: 3839660 (1974-10-01), Stryker
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4974057 (1990-11-01), Tazima
patent: 5065281 (1991-11-01), Hernandez et al.

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