Integrated circuit package with improved connections

Details Integrated circuit package with improved connections Integrated circuit package with improved connections

2011-03-22

2011-03-22

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257SE23037, C257S676000, C257S686000, C438S123000

Reexamination Certificate

active

07911040

ABSTRACT:
An integrated circuit package system comprising: providing an integrated circuit die; forming a top paddle over the integrated circuit die wherein the top paddle has planar dimensions smaller than planar dimensions of the integrated circuit die; forming leads adjacent the top paddle; attaching first connectors to the integrated circuit die and the top paddle; attaching second connectors to the integrated circuit die and the leads; and forming an encapsulant over the first connectors, the second connectors, the integrated circuit die, and the top paddle.

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