Integrated circuit package system with lead structures...

Details Integrated circuit package system with lead structures... Integrated circuit package system with lead structures...

2011-05-03

2011-05-03

Kebede, Brook (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257SE23012

Reexamination Certificate

active

07936053

ABSTRACT:
An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures.

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