LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat dissipation semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat radiative electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat sink bonded to a die paddle having at least one aperture

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Heat sink for semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat sink packaging assembly for electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat spreader for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat spreader hole pin 1 identifier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat spreader structures in scribe lines

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat spreader suitable for use in semiconductor packages having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heatsink for surface mount device for circuit board mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Hermetically sealed ceramic integrated circuit heat dissipating

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Hermetically sealed integrated circuit lead-on package configura

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Heterogeneous integrated high voltage DC/AC light emitter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

High aspect ratio integrated circuit chip and method for produci

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

High bond line thickness for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

High current capacity semiconductor device housing

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

High current semiconductor device package with plastic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

High density chip scale leadframe package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

High density chip scale leadframe package and method of...