Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1994-10-24
1996-11-05
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257675, 257700, 257704, 257725, H01L 23495
Patent
active
055720650
ABSTRACT:
A method and apparatus for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.
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Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when this information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870.
Potter Roy
Saadat Mahshid
Staktek Corporation
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