Hermetically sealed integrated circuit lead-on package configura

Details Hermetically sealed integrated circuit lead-on package configura Hermetically sealed integrated circuit lead-on package configura

1995-01-30

1998-09-08

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257675, 257700, 257704, 257725, H01L 23495

Patent

active

058048707

ABSTRACT:
A hermetically sealed ceramic integrated circuit package and method for achieving same, the package including an internal lead frame attached to an integrated circuit die in a lead-on-chip configuration, an external lead frame attached to the package exterior in a lead-on-package configuration and a high temperature adhesive layer which attaches the internal lead frame to the integrated circuit die.

REFERENCES:
patent: 5572065 (1996-11-01), Burns

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