High aspect ratio integrated circuit chip and method for produci

Details High aspect ratio integrated circuit chip and method for produci High aspect ratio integrated circuit chip and method for produci

1997-12-05

1999-08-17

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

059397772

ABSTRACT:
An integrated circuit chip package (10) including a high aspect ratio integrated circuit chip (12) is disclosed. The chip (12) has a length (L1) than is greater than three times its width (L2). The chip includes a plurality of circuit functional blocks (14), each having a plurality of integrated circuit components and bond pads (16) for the input and output of signals. In one embodiment, the circuit functional blocks (14) are aligned in parallel to form a row of circuit functional blocks. The high aspect ratio integrated circuit chip (12) requires less wafer area than a comparable low aspect ratio chip, thus allowing more chips to be made from a single semiconductor wafer at a lower cost per chip. Moreover, the disclosed method for producing a high aspect ratio integrated circuit chip package (10) minimizes the risk of cracking the high aspect ratio integrated circuit chip (12) during the packaging process.

REFERENCES:
patent: 5399898 (1995-03-01), Rostoker

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