Heat spreader structures in scribe lines

Details Heat spreader structures in scribe lines Heat spreader structures in scribe lines

2011-03-15

2011-03-15

Smith, Matthew S (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257SE21523, C438S122000

Reexamination Certificate

active

07906836

ABSTRACT:
An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.

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