Heat spreader for semiconductor package

Details Heat spreader for semiconductor package Heat spreader for semiconductor package

2006-09-20

2011-11-01

Hoang, Quoc (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000, C257SE33075

Reexamination Certificate

active

08049313

ABSTRACT:
A heat spreader (50) for a semiconductor package (100) includes a heat dissipating portion (52) having a recessed periphery (54). A thermosetting resin (58) is disposed in the recessed periphery (54). The heat spreader (50) may include a heat absorbing portion (56) coupled to the heat dissipating portion (52).

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