Heatsink for surface mount device for circuit board mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Patent

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Details

257712, 257713, 257721, 257722, H01L 23495

Patent

active

058048731

ABSTRACT:
A surface mount package is provided with a U-shaped heatsink which is coupled to exposed portions of a bottom plate of the package. The bottom plate of the surface mount package is provided with border strips which extend beyond the edge of an encapsulated portion of the package such that the heatsink may be coupled thereto.

REFERENCES:
patent: 5047837 (1991-09-01), Kitano et al.

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