Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1997-01-30
1998-09-08
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257712, 257713, 257721, 257722, H01L 23495
Patent
active
058048731
ABSTRACT:
A surface mount package is provided with a U-shaped heatsink which is coupled to exposed portions of a bottom plate of the package. The bottom plate of the surface mount package is provided with border strips which extend beyond the edge of an encapsulated portion of the package such that the heatsink may be coupled thereto.
REFERENCES:
patent: 5047837 (1991-09-01), Kitano et al.
International Rectifier Corporation
Potter Roy
Thomas Tom
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