Heat sink packaging assembly for electronic components

Details Heat sink packaging assembly for electronic components Heat sink packaging assembly for electronic components

2007-08-21

2007-08-21

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000, C257SE33075

Reexamination Certificate

active

11213200

ABSTRACT:
A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) with which to independently bias each die (102, 104, 106) while the heat sink (108) provides thermal dissipation for the die. Assembly (100) provides a surface mountable package well suited to multiband applications.

REFERENCES:
patent: 5367434 (1994-11-01), Griffin et al.
patent: 5379185 (1995-01-01), Griffin et al.
patent: 6208526 (2001-03-01), Griffin et al.
patent: 6842341 (2005-01-01), Waldvogel et al.

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