Heat sink packaging assembly for electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S706000, C257SE33075

Reexamination Certificate

active

11213200

ABSTRACT:
A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) with which to independently bias each die (102, 104, 106) while the heat sink (108) provides thermal dissipation for the die. Assembly (100) provides a surface mountable package well suited to multiband applications.

REFERENCES:
patent: 5367434 (1994-11-01), Griffin et al.
patent: 5379185 (1995-01-01), Griffin et al.
patent: 6208526 (2001-03-01), Griffin et al.
patent: 6842341 (2005-01-01), Waldvogel et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat sink packaging assembly for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink packaging assembly for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink packaging assembly for electronic components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3874300

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.