Apparatus for thermally coupling a heat sink to a lead frame
Apparatus for thermally coupling a heat sink to a leadframe
Bent tip method for preventing vertical motion of heat spreaders
CCD mold package with improved heat radiation structure
Ceramic semiconductor package having varying conductive bonds
Chip carrier and system including a chip carrier and...
Chip mounting scheme
Chip on board with heat sink attachment
Chip package
Chip package structure and manufacturing method thereof
Conformal shield on punch QFN semiconductor package
Double-sided thermally enhanced IC chip package
Dual side cooling integrated power device package and module...
Electronic circuit component with heat sink mounted on a lead fr
Electronic circuit with diamond substrate and conductive vias
Electronic component having a power switch with an anode...
Electronic component having a semiconductor chip, system...
Electronic package
Encapsulated semiconductor device having a hanging heat spreadin
Grounded embedded flip chip RF integrated circuit