4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With heat sink means
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Thermal ball lead integrated package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Thermal enhanced package for block mold assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Thermal enhanced upper and dual heat sink exposed molded...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Thermal enhanced upper and dual heat sink exposed molded...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Thermally enhanced component substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Thermally enhanced single inline package (SIP)

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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TMOS-infrared uncooled sensor and focal plane array

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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