Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1996-09-16
1999-02-16
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257796, 257712, 257667, 257707, 257711, H01L 23495, H01L 2328
Patent
active
058723951
ABSTRACT:
A heat spreader to be molded into an encapsulated IC package in contact with a die attach pad carrying an IC die is adapted to be placed in a substantially rectangular mold cavity and to retain its position in the cavity while encapsulation material is injected. The heat spreader has a body portion with appendages extending toward each of the four walls, and the ends of the appendages furthest from the body are formed downward such as by bending to provide a support for the spreader from the bottom surface of the mold cavity substantially at the lines where the sidewalls meet the bottom surface of the mold cavity. In a preferred embodiment there are two appendages toward each sidewall, and the heat spreader before and during the molding process is supported from the bottom surface of the mold cavity by dimples through the body, forming additional supports.
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Boys Donald R.
International Packaging and Assembly Corporation
Thomas Tom
Williams Alexander Oscar
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