Electronic component having a power switch with an anode...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Reexamination Certificate

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Details

C257S666000, C257S678000, C257S690000, C257S692000, C257S712000, C257S734000, C257S735000, C257S778000, C257S784000

Reexamination Certificate

active

07598603

ABSTRACT:
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a second surface and a heat sink with a die attach region with an upper surface. The electronic component also comprises a plurality of leads. A control lead has an upper surface which lies in a plane generally coplanar with the upper surface of the die attach region in its inner portion and above the upper surface of the inner portion in its centre portion. The anode of the semiconductor power switch is mounted on the die attach region of the heat sink and at least one control electrode is mounted on the upper surface of the inner portion of the control lead.

REFERENCES:
patent: 5982029 (1999-11-01), Graf
patent: 6483181 (2002-11-01), Chang et al.
patent: 6661087 (2003-12-01), Wu
patent: 7335534 (2008-02-01), Pavio
patent: 2002/0130397 (2002-09-01), Yew et al.
patent: 2006/0017174 (2006-01-01), Otremba
patent: 2006/0043611 (2006-03-01), Kinsman
patent: 2007/0181908 (2007-08-01), Otremba
patent: 102004030042 (2006-01-01), None
patent: 1563870 (1997-12-01), None
Andrew Sawle, “DirectFET—A Proprietary New Source Mounted Power Package for Board Mounted Power,” 5 pages.
Väänänen et al., “Reducing the Crest Factor of a CDMA Downlink Signal by Adding Unused Channelization Codes,” IEEE Communication Letters, vol. 6, No. 10, pp. 443-445, Oct. 2002.

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