Electronic circuit with diamond substrate and conductive vias

Details Electronic circuit with diamond substrate and conductive vias Electronic circuit with diamond substrate and conductive vias

1993-04-28

1994-12-06

Larkins, William D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257700, 257702, 257707, 257713, 437203, 361708, 361739, H01L 2302

Patent

active

053714075

ABSTRACT:
The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the via hole in the diamond material. Cracking of the diamond substrate, and loose or lost via elements, are minimized. A form of the disclosure is directed to a method for producing a circuit board having a multiplicity of conductive vias. A generally planar diamond substrate is provided. A multiplicity of via holes are formed through the substrate. The holes are loaded with a conductive reactive braze material. The braze material and the substrate are heated to a temperature which causes the braze material to melt and to react with the inner surface of the via holes and bond thereto. In an illustrated embodiment, the braze material comprises a conductive matrix component that includes at least one element selected from the group consisting of copper, silver, and gold, and a reactive component that includes at least one element selected from the group consisting of titanium, chromium, vanadium, zirconium, and hafnium. Another form of the disclosure is directed to a circuit board in which conductive vias pass through a diamond substrate and form a compound with the substrate at the inner surface of the via holes to bond to said inner surface of the via holes.

REFERENCES:
patent: 4009027 (1977-02-01), Naidich et al.
patent: 4131516 (1978-12-01), Bakos et al.
patent: 4313262 (1982-02-01), Barnes et al.
patent: 5055424 (1991-10-01), Zeidler et al.
patent: 5133120 (1992-07-01), Kawakami et al.

Affiliated with

Also associated with

Rating

Electronic circuit with diamond substrate and conductive vias does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit with diamond substrate and conductive vias, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit with diamond substrate and conductive vias will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-216821