Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1994-04-21
1995-08-15
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257718, 361709, 361723, H01L 2348, H01L 2944, H01L 2752, H01L 2960
Patent
active
054422345
ABSTRACT:
A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. One or more holes are formed in the lead frame and are engaged by corresponding studs on the heat sink. The stud has a shoulder portion which engages the lead frame to prevent the stud from further passing through the hole in the lead frame.
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R. D., Oct. 1990, No. 318, Spring-Loaded Heat Sinks for VLSI Packages, Amonoynously.
Arroyo Teresa
King Patrick T.
Limanek Robert P.
VLSI Technology Inc.
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