Package for integrated circuit die
Package for receiving electronic parts, and electronic...
Package, semiconductor device and method for fabricating the...
Packaged microelectronic devices including first and second...
Packaged microelectronic elements with enhanced thermal conducti
Packaged semiconductor device and a lead frame therefor, having
Plastic body surface-mounting semiconductor power device having
Plastic molded semiconductor package
Plastic package type semiconductor device having a rolled metal
Plastic surface mount large area power device
Power management integrated circuit
Power module having a heat sink
Power module with closely spaced printed circuit board and...
Power semiconductor device and power semiconductor module
Printed circuit board for thermal dissipation and electronic...