Electronic circuit component with heat sink mounted on a lead fr

Details Electronic circuit component with heat sink mounted on a lead fr Electronic circuit component with heat sink mounted on a lead fr

1993-01-29

1994-09-06

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257672, 257706, 257707, 257796, 257773, 257666, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053451066

ABSTRACT:
A standard lead frame has a carrier pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to the conducting paths on the lead frame the unit is encapsulated in such a fashion that a major surface of the heat sink protrudes from the encapsulation. A standard lead frame may be used as the carrier.

REFERENCES:
patent: 3651448 (1972-03-01), Pauza
patent: 3657611 (1972-04-01), Yoneda
patent: 3657805 (1972-04-01), Johnson
patent: 3686748 (1972-08-01), Engeler et al.
patent: 3698075 (1972-10-01), Boyle
patent: 3922775 (1975-12-01), Potter
patent: 4360965 (1982-11-01), Fujiwara
patent: 4633573 (1987-01-01), Scherer
patent: 4639277 (1987-01-01), Hawkins
patent: 4722914 (1988-02-01), Drye et al.
patent: 4864384 (1989-09-01), Boudot et al.
patent: 4951119 (1990-08-01), Yonemochi et al.
patent: 4975761 (1990-12-01), Chu
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5014114 (1991-05-01), Heckaman et al.
patent: 5041396 (1991-08-01), Valero
patent: 5045503 (1991-09-01), Kobiki et al.
patent: 5099310 (1992-03-01), Osada et al.
Miroelectronics Packaging Handbook, Rao R. Tummala et al, pp. 523-553.

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