Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1997-09-17
1999-04-13
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257705, 257706, 257780, H01L 23495, H01L 2306, H01L 2310
Patent
active
058941665
ABSTRACT:
To mount a semiconductor i.c. die on a support substrate the upper surface of the die is provided with electrically conductive bumps all of which are the same height. The bumps are provided on the ground connection pads on the upper surface of the die. The conductive pads on the die including the ground connection pads are connected to corresponding contacts on the upper surface of the substrate on which the die is mounted. Additionally, a thermally conductive, electrically conductive slug overlies the die and is mounted on and bonded to the bumps. The slug provides required heat removal from the die and also provides necessary ground connection to circuitry within the die.
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E. Jan Vardaman & R. Crowley, "Emerging Flip Chip Use -LCDs, Watches, and Computers Drive Demand", pp. 8-9; Suss Report, Q1-1995.
D. Gupta, "A Novel Active Area Bumped Flip Chip Technology for Convergent Heat Transfer from Gallium Arsenide Power Devices", IEEE Transactions on Components, Packaging and Manufacturing Technology; Party A., vol. 18, No. 1, Mar. 1995, pp. 82-86.
Clark Jhihan B.
Northern Telecom Limited
Saadat Mahshid
LandOfFree
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