Chip mounting scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

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Details

257705, 257706, 257780, H01L 23495, H01L 2306, H01L 2310

Patent

active

058941665

ABSTRACT:
To mount a semiconductor i.c. die on a support substrate the upper surface of the die is provided with electrically conductive bumps all of which are the same height. The bumps are provided on the ground connection pads on the upper surface of the die. The conductive pads on the die including the ground connection pads are connected to corresponding contacts on the upper surface of the substrate on which the die is mounted. Additionally, a thermally conductive, electrically conductive slug overlies the die and is mounted on and bonded to the bumps. The slug provides required heat removal from the die and also provides necessary ground connection to circuitry within the die.

REFERENCES:
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5341979 (1994-08-01), Gupta
patent: 5367765 (1994-11-01), Kusaka
patent: 5506756 (1996-04-01), Haley
patent: 5532512 (1996-07-01), Fillion et al.
patent: 5610442 (1997-03-01), Schneider et al.
patent: 5724230 (1998-03-01), Poetzinger
patent: 5786635 (1998-07-01), Alcoe et al.
E. Jan Vardaman & R. Crowley, "Emerging Flip Chip Use -LCDs, Watches, and Computers Drive Demand", pp. 8-9; Suss Report, Q1-1995.
D. Gupta, "A Novel Active Area Bumped Flip Chip Technology for Convergent Heat Transfer from Gallium Arsenide Power Devices", IEEE Transactions on Components, Packaging and Manufacturing Technology; Party A., vol. 18, No. 1, Mar. 1995, pp. 82-86.

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