Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1993-05-18
1994-08-02
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257666, 257713, 257717, 257787, 257796, H01L 2348, H01L 2328, H01L 2302, H01L 2754
Patent
active
053348729
ABSTRACT:
A packaged semiconductor device includes a semiconductor chip having first and second surfaces, a plurality of electrodes formed on the first surface of the semiconductor chip, a die pad bonded to the second surface of the semiconductor chip for supporting the semiconductor chip, a plurality of leads having first and second ends, the first ends being connected to corresponding electrodes of the semiconductor chip, a heat spreading plate disposed in opposed relation to the die pad and having an area larger than that of the die pad, at least one end portion of the heat spreading plate lying in the same plane as the second ends of the plurality of leads, and a resin package body encapsulating the semiconductor chip, the die pad, the first ends of the plurality of leads, and the heat spreading plate.
REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4864384 (1989-09-01), Boudot et al.
patent: 4887149 (1989-12-01), Romano' 357 81
Nakagawa Osamu
Ueda Tetsuya
Crane Sara W.
Jr. Carl Whitehead
Mitsubishi Denki & Kabushiki Kaisha
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