4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With heat sink means
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Resin mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Resin sealing type semiconductor device and method of making the

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Resin sealing type semiconductor device having thin portions for

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Resin-sealed semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Resin-sealed semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Resin-sealed semiconductor device capable of improving in heat r

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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