Chip carrier and system including a chip carrier and...

Details Chip carrier and system including a chip carrier and... Chip carrier and system including a chip carrier and...

2006-02-22

2009-12-22

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S676000, C257S677000

Reexamination Certificate

active

07635911

ABSTRACT:
A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.

REFERENCES:
patent: 6153928 (2000-11-01), Cho
patent: 6380613 (2002-04-01), Shen
patent: 7235877 (2007-06-01), Pavier
patent: 2002/0140071 (2002-10-01), Leighton et al.
patent: 2004/0214373 (2004-10-01), Jiang et al.
patent: 39 22 485 (1990-06-01), None

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