Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2007-07-27
2010-02-16
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257SE23125, C257SE23031, C257SE23034, C257SE23044, C257SE23046, C257SE23052, C257SE23101, C257SE23124, C257SE21506, C257S778000, C257S685000, C257S723000, C257S712000, C257S713000, C257S717000, C257S720000, C257S737000, C257S738000, C438S123000, C438S108000
Reexamination Certificate
active
07663211
ABSTRACT:
An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and second pads, wherein the source of said second transistor is electrically connected to said one or more common source-drain leads, and a first clip attached to the drain of said first transistor and electrically connected to said one or more common source-drain leads. In another embodiment a partially encapsulated power quad flat no-lead package having an exposed top thermal drain clip which is substantially perpendicular to said with a folded stud exposed top thermal drain clip, and an exposed thermal source pad.
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Madrid Ruben
Noquil Jonathan A.
Fairchild Semiconductor Corporation
Hiscock & Barclay LLP
Williams Alexander O
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