LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ultra thin dual chip image sensor package structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ultra thin, leadless and molded surface mount integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Ultra wideband BGA

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ultra wideband system-on-package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Ultra-thin card-type semiconductor device having an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ultra-thin composite package for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Ultra-thin semiconductor package device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Ultrathin electronics using stacked layers and interconnect vias

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Underfill and mold compounds including siloxane-based...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Underfill and mold compounds including siloxane-based...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Underfill of chip-under-chip semiconductor modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Unique feature design enabling structural integrity for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Unit semiconductor chip and multi chip package with center...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Unitary silicon die module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Universal interconnect die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Universal land grid array socket engagement mechanism

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Universal pad arrangement for surface mounted semiconductor...