Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-08-23
2005-08-23
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S531000, C257S728000
Reexamination Certificate
active
06933596
ABSTRACT:
An electronic device packaging assembly (10) that includes a ball grid array (60) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly (10) includes a thin base plate (14) made of a suitable rigid material. Power vias (48), signal vias (26) and ground vias (46) are formed through the base plate (14) to be coupled to traces, circuit components, and/or the device (12) within the packaging assembly (10). An impedance matching compensation network (28) provides impedance matching between the device (12) and the signal vias (26). The ball grid array (60) includes a plurality of solder balls (68), including ground solder balls (72), signal solder balls (74) and power solder balls (76), electrically coupled to the appropriate via extending through the base plate (14).
REFERENCES:
patent: 5023624 (1991-06-01), Heckaman et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5717245 (1998-02-01), Pedder
patent: 5787580 (1998-08-01), Woo
patent: 5955789 (1999-09-01), Vendramin
patent: 6020637 (2000-02-01), Karnezos
patent: 6084777 (2000-07-01), Kalidas et al.
patent: 6184477 (2001-02-01), Tanahashi
patent: 6194669 (2001-02-01), Bjorndahl et al.
patent: 6215184 (2001-04-01), Stearns et al.
patent: 6218731 (2001-04-01), Huang et al.
patent: 6242815 (2001-06-01), Hsu et al.
patent: 6301401 (2001-10-01), La
patent: 6310386 (2001-10-01), Shenoy
patent: 6329606 (2001-12-01), Freyman et al.
patent: 6449168 (2002-09-01), Soderholm
patent: 6686882 (2004-02-01), Petros et al.
patent: 2001/0015497 (2001-08-01), Zhao et al.
patent: 2001/0023782 (2001-09-01), Nakamura
patent: 2003/0169207 (2003-09-01), Beigel
Crossman Brian F.
Din Salah
Hathaway James A.
Miller John A.
Nelms David
Northrop Grumman Corporation
Tran Long
Warn, Hoffmann, Miller & LaLone, P.C.
LandOfFree
Ultra wideband BGA does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultra wideband BGA, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultra wideband BGA will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3443973